Technical Data Sheet (TDS)

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TEF 221 M

Hot melt adhesive for tray forming applications. Suitable for short pressing.

Uses

TEF 221 M is a 100 % solid hot-melt adhesive for tray forming applications. Suitable for cardboard with high spring back. Suitable for high-speed packaging lines.

Benefits

  • Very good wetting properties on standard cardboard
  • Good wetting properties on treated carton
  • Suitable for short pressing and high spring back
  • All ingredients are approved under the Federal regulation 175 105 & BGA (for incidental contact of adhesives with food)
  • Good thermal stability
  • Good tack
  • Good resistance to fridge low positive temperatures (from 0 to +5°C).
  • Suitable for application by nozzle (Nordson, Valco, Robatech, etc.)
  • Suitable for application by wheel (never exceed 180°C)

Properties

Physical:

  • Aspect: pellets
  • Colour: pale yellow
  • Thermosel Viscosity– spindle 21, 20 rpm at 170°C: 1300 - 2000 mPas
  • Softening point, Ring and Ball: approx. 103-111°C
  • Open time*: approx. 1 second
  • Setting time*: approx. 1 to 5 seconds


* Open and setting times are tested according to Bostik internal method. Open and setting times may vary depending on:

  • ambient temperature, temperature of the substrate, adhesive application temperature
  • coverage
  • nature and porosity of the substrate

Shelf life:

2 years in original unopened packaging, stored at ambient temperature. Keep away from humidity.

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Application

Application temperature: 160–180°C. Application by nozzle or wheel (never exceed 180°C). 

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Packaging

Presentation Bar code Bostik code
bag - 25 kg 064030